JPH0177117U - - Google Patents
Info
- Publication number
- JPH0177117U JPH0177117U JP1987172309U JP17230987U JPH0177117U JP H0177117 U JPH0177117 U JP H0177117U JP 1987172309 U JP1987172309 U JP 1987172309U JP 17230987 U JP17230987 U JP 17230987U JP H0177117 U JPH0177117 U JP H0177117U
- Authority
- JP
- Japan
- Prior art keywords
- cup
- cap
- clip
- cam groove
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17230987U JPH0356646Y2 (en]) | 1987-11-11 | 1987-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17230987U JPH0356646Y2 (en]) | 1987-11-11 | 1987-11-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0177117U true JPH0177117U (en]) | 1989-05-24 |
| JPH0356646Y2 JPH0356646Y2 (en]) | 1991-12-20 |
Family
ID=31464284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17230987U Expired JPH0356646Y2 (en]) | 1987-11-11 | 1987-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356646Y2 (en]) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045508U (en]) * | 1990-05-01 | 1992-01-20 | ||
| US6988942B2 (en) | 2000-02-17 | 2006-01-24 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7160432B2 (en) | 2001-03-14 | 2007-01-09 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7384534B2 (en) | 2001-12-21 | 2008-06-10 | Applied Materials, Inc. | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP |
| US7582564B2 (en) | 2001-03-14 | 2009-09-01 | Applied Materials, Inc. | Process and composition for conductive material removal by electrochemical mechanical polishing |
-
1987
- 1987-11-11 JP JP17230987U patent/JPH0356646Y2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045508U (en]) * | 1990-05-01 | 1992-01-20 | ||
| US6988942B2 (en) | 2000-02-17 | 2006-01-24 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7160432B2 (en) | 2001-03-14 | 2007-01-09 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7582564B2 (en) | 2001-03-14 | 2009-09-01 | Applied Materials, Inc. | Process and composition for conductive material removal by electrochemical mechanical polishing |
| US7384534B2 (en) | 2001-12-21 | 2008-06-10 | Applied Materials, Inc. | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356646Y2 (en]) | 1991-12-20 |